Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021015 | Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substrate | Hiroki Tamiya, Koji Kishino, Yasunori HOSHINO, Takahiro Yamada, Shimpei Obata +3 more | 2024-06-25 |
| 12003236 | Semiconductor device | Kazuya Matsuzawa | 2024-06-04 |
| 11869797 | Electrostatic chuck and method of manufacturing electrostatic chuck | Naomi Okamoto | 2024-01-09 |