Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021015 | Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substrate | Koji Kishino, Ryuji Takahashi, Yasunori HOSHINO, Takahiro Yamada, Shimpei Obata +3 more | 2024-06-25 |