AK

Andrej Kolbasow

PG Pac Tech—Packaging Technologies Gmbh: 3 patents #1 of 4Top 25%
📍 Paulinenaue, DE: #1 of 1 inventorsTop 100%
Overall (2024): #94,628 of 561,600Top 20%
3
Patents 2024

Issued Patents 2024

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
12171066 Method for removing and repositioning electronic components connected to a circuit board Matthias Fettke 2024-12-17
12023756 Method for removing electronic components connected to a circuit board Matthias Fettke 2024-07-02
12028987 Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole Matthias Fettke, Nico Lange 2024-07-02