Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12028987 | Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole | Matthias Fettke, Andrej Kolbasow | 2024-07-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12028987 | Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole | Matthias Fettke, Andrej Kolbasow | 2024-07-02 |