Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12106980 | Adhesive transfer stamp and method for transferring a semiconductor chip using an adhesive transfer stamp | Hubert Halbritter, Mikko Peraelae | 2024-10-01 |
| 12059881 | Interbonded components, method for detaching components from interbonded components, and method for producing interbonded components | Korbinian Perzlmaier | 2024-08-13 |
| 12027503 | Component and method for producing a component | — | 2024-07-02 |