Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12106980 | Adhesive transfer stamp and method for transferring a semiconductor chip using an adhesive transfer stamp | Hubert Halbritter, Alexander F. Pfeuffer | 2024-10-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12106980 | Adhesive transfer stamp and method for transferring a semiconductor chip using an adhesive transfer stamp | Hubert Halbritter, Alexander F. Pfeuffer | 2024-10-01 |