Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12134146 | Bonding member, method for producing bonding member and method for producing bonding structure | Chuantong CHEN, Toshiyuki ISHINA, Seungjun NOH, Chanyang CHOE | 2024-11-05 |
| 12119131 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | Jinting Jiu, Minoru Ueshima, Wanli Li | 2024-10-15 |
| 12094850 | Bonding structure production method and bonding structure | Chuantong CHEN, Zheng Zhang | 2024-09-17 |