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Chuantong CHEN

OU Osaka University: 2 patents #17 of 279Top 7%
📍 Suita, JP: #13 of 114 inventorsTop 15%
Overall (2024): #179,140 of 561,600Top 35%
2
Patents 2024

Issued Patents 2024

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12134146 Bonding member, method for producing bonding member and method for producing bonding structure Katsuaki Suganuma, Toshiyuki ISHINA, Seungjun NOH, Chanyang CHOE 2024-11-05
12094850 Bonding structure production method and bonding structure Katsuaki Suganuma, Zheng Zhang 2024-09-17