Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11978682 | Package, and method for manufacturing power semiconductor module | Akiyoshi Osakada, Teppei Yamaguchi | 2024-05-07 |
| 11901268 | Package with an electrode-attached frame supported by a heat sink, and method for manufacturing power semiconductor module provided therewith | Teppei Yamaguchi | 2024-02-13 |