Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11978682 | Package, and method for manufacturing power semiconductor module | Yoshio Tsukiyama, Akiyoshi Osakada | 2024-05-07 |
| 11958891 | Tissue-specific Wnt signal enhancing molecules and uses thereof | Zhengjian ZHANG, Jennifer Jean BRADY, Aaron Sato, Wen-Chen YEH, Yang Li | 2024-04-16 |
| 11901268 | Package with an electrode-attached frame supported by a heat sink, and method for manufacturing power semiconductor module provided therewith | Yoshio Tsukiyama | 2024-02-13 |