Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12109640 | Ceramic-copper composite, ceramic circuit board, power module, and method of producing ceramic-copper composite | Akimasa YUASA, Koji Nishimura | 2024-10-08 |
| 12065385 | Ceramic-copper composite, method of producing ceramic-copper composite, ceramic circuit board, and power module | Akimasa YUASA, Shuhei MORITA, Koji Nishimura | 2024-08-20 |
| 11875901 | Registration apparatus, registration method, and recording medium | Miaomei LEI, Daisuke Suzuki, Takashi Takemoto | 2024-01-16 |