Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12065385 | Ceramic-copper composite, method of producing ceramic-copper composite, ceramic circuit board, and power module | Akimasa YUASA, Takahiro Nakamura, Koji Nishimura | 2024-08-20 |