Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12014955 | Method for fabricating conductive layer stack and method for fabricating semiconductor device with gate contact | Che-Hsien Liao | 2024-06-18 |
| 11937420 | Memory device having word line with improved adhesion between work function member and conductive layer | Wei CHEN | 2024-03-19 |
| 11895820 | Method of manufacturing memory device having word line with improved adhesion between work function member and conductive layer | Wei CHEN | 2024-02-06 |
| 11876051 | Conductive layer stack and semiconductor device with a gate contact | Che-Hsien Liao | 2024-01-16 |