Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11937420 | Memory device having word line with improved adhesion between work function member and conductive layer | Yueh Hsu | 2024-03-19 |
| 11903180 | Method of manufacturing semiconductor device having word line structure | Cheng Ji | 2024-02-13 |
| 11895820 | Method of manufacturing memory device having word line with improved adhesion between work function member and conductive layer | Yueh Hsu | 2024-02-06 |