Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12050235 | Heat dissipatable die unit and probe seat using the same | Chin-Yi Lin, Che-Wei Lin, KO-CHUN WU | 2024-07-30 |
| D1031738 | Die plate assembly for probe head | Chin-Yi Lin, Che-Wei Lin, Hsin-Cheng Hung | 2024-06-18 |