Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12050235 | Heat dissipatable die unit and probe seat using the same | Chin-Yi Lin, Keng-Min Su, KO-CHUN WU | 2024-07-30 |
| D1031738 | Die plate assembly for probe head | Chin-Yi Lin, Keng-Min Su, Hsin-Cheng Hung | 2024-06-18 |
| 11874313 | Probe card and manufacturing method thereof | Chin-Yi Lin, Ting-Ju Wu, Chien-Kai Hung | 2024-01-16 |