Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11884815 | Thermosetting resin composition, coverlay film, adhesive sheet, and flexible printed wiring board | Takashi GONDAIRA, Katsuhiko Furukawa, Takuma Sugai | 2024-01-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11884815 | Thermosetting resin composition, coverlay film, adhesive sheet, and flexible printed wiring board | Takashi GONDAIRA, Katsuhiko Furukawa, Takuma Sugai | 2024-01-30 |