Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12122867 | Photocurable resin composition and use thereof | Makoto Tai | 2024-10-22 |
| 11884815 | Thermosetting resin composition, coverlay film, adhesive sheet, and flexible printed wiring board | Katsuhiko Furukawa, Shota ABE, Takuma Sugai | 2024-01-30 |