Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908768 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara | 2024-02-20 |