Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908768 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Ryohei Yumoto, Tomoya Oohiraki, Yoshiyuki Nagatomo | 2024-02-20 |
| 11871275 | Node apparatus, method for controlling the same, and storage medium | Nobutaka Matsumoto, Koutarou Ichikawa, Akinari Nanba | 2024-01-09 |