Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183647 | Packaging of a semiconductor device with dual sealing materials | Junji Fujino, Hiroshi Kawashima, Taketoshi MAEDA | 2024-12-31 |
SS
Soichi Sakamoto
Overall (2024): #263,339 of 561,600Top 50%
1
Patents 2024