Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183647 | Packaging of a semiconductor device with dual sealing materials | Soichi Sakamoto, Hiroshi Kawashima, Taketoshi MAEDA | 2024-12-31 |
| 12087651 | Semiconductor device and method of manufacturing the same | Kazuma Noda, Satoshi Kondo, Michio Ogawa | 2024-09-10 |
| 12062883 | Semiconductor module and method of manufacturing same | Yutaka Yoneda, Tadayoshi Hata, Jin Sato | 2024-08-13 |