Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087738 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Tongbi Jiang | 2024-09-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087738 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Tongbi Jiang | 2024-09-10 |