Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087738 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Yong Poo Chia | 2024-09-10 |
| 12074244 | Optical sensor package with magnetic component for device attachment | Saijin Liu, Saahil Mehra | 2024-08-27 |
| 11917773 | Systems and methods for magnetic barrier assembly | Saijin Liu | 2024-02-27 |
| 11869809 | Semiconductor components having conductive vias with aligned back side conductors | Jin Li | 2024-01-09 |