Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040182 | Plasma doping of gap fill materials | Santanu Sarkar, Jay Steven Brown, Yongjun Jeff Hu, Farrell M. Good | 2024-07-16 |
| 12040211 | Devices, systems and methods for electrostatic force enhanced semiconductor bonding | Ming Zhang | 2024-07-16 |