Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040182 | Plasma doping of gap fill materials | Jay Steven Brown, Shu Qin, Yongjun Jeff Hu, Farrell M. Good | 2024-07-16 |
| 12027363 | Methods of forming electronic devices comprising silicon carbide materials | Farrell M. Good | 2024-07-02 |
| 11948984 | Methods of forming conductive pipes between neighboring features, and integrated assemblies having conductive pipes between neighboring features | Ahmed N. Noemaun, Stephen W. Russell, Tao Nguyen | 2024-04-02 |