Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136607 | Semiconductor devices including stacked dies with interleaved wire bonds and associated systems and methods | Koichi Kawai, Takehiro Hasegawa, Chang Hua Siau | 2024-11-05 |
| 12125789 | Semiconductor device and method of forming the same | Shigeru Sugioka, Hidenori Yamaguchi, Noriaki Fujiki, Keizo Kawakita | 2024-10-22 |
| 11876068 | Bond pad connection layout | Bharat Bhushan, Pratap Murali, David Daycock | 2024-01-16 |