Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136607 | Semiconductor devices including stacked dies with interleaved wire bonds and associated systems and methods | Koichi Kawai, Raj K. Bansal, Chang Hua Siau | 2024-11-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136607 | Semiconductor devices including stacked dies with interleaved wire bonds and associated systems and methods | Koichi Kawai, Raj K. Bansal, Chang Hua Siau | 2024-11-05 |