Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183716 | Monolithic conductive columns in a semiconductor device and associated methods | Wei Zhou, Bret K. Street, Kunal R. Parekh | 2024-12-31 |
| 12107050 | Front end of line interconnect structures and associated systems and methods | Kunal R. Parekh | 2024-10-01 |
| 12074094 | Monolithic conductive column in a semiconductor device and associated methods | Wei Zhou, Bret K. Street, Kunal R. Parekh | 2024-08-27 |
| 12046559 | Semiconductor memory stacks connected to processing units and associated systems and methods | — | 2024-07-23 |
| 11978656 | Semiconductor with through-substrate interconnect | Kunal R. Parekh | 2024-05-07 |
| 11973062 | High density pillar interconnect conversion with stack to substrate connection | Owen R. Fay, Akshay N. Singh | 2024-04-30 |
| 11942444 | Semiconductor interconnect structures with vertically offset bonding surfaces, and associated systems and methods | — | 2024-03-26 |
| 11942428 | Inductors with through-substrate via cores | — | 2024-03-26 |
| 11862569 | Front end of line interconnect structures and associated systems and methods | Kunal R. Parekh | 2024-01-02 |