AS

Akshay N. Singh

Micron: 1 patents #790 of 1,553Top 55%
📍 Boise, ID: #349 of 684 inventorsTop 55%
🗺 Idaho: #527 of 1,264 inventorsTop 45%
Overall (2024): #553,814 of 561,600Top 100%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11973062 High density pillar interconnect conversion with stack to substrate connection Owen R. Fay, Kyle K. Kirby 2024-04-30