Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12028962 | Thermal management of circuit boards | Xiaopeng Qu | 2024-07-02 |
| 12015011 | Semiconductor device assemblies and systems with improved thermal performance and methods for making the same | Xiaopeng Qu | 2024-06-18 |
| 11915997 | Thermal management of GPU-HBM package by microchannel integrated substrate | Xiaopeng Qu, Eiichi Nakano | 2024-02-27 |
| 11887920 | Redistribution layers including reinforcement structures and related semiconductor device packages, systems and methods | Chan H. Yoo, Tracy N. Tennant | 2024-01-30 |