Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051670 | Use of pre-channeled materials for anisotropic conductors | Mark E. Tuttle, John F. Kaeding, Owen R. Fay, Shijian Luo | 2024-07-30 |
| 11915997 | Thermal management of GPU-HBM package by microchannel integrated substrate | Xiaopeng Qu, Hyunsuk Chun | 2024-02-27 |
| 11881468 | Anisotropic conductive film with carbon-based conductive regions and related semiconductor device assemblies and methods | Mark E. Tuttle | 2024-01-23 |