Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862607 | Composite dielectric structures for semiconductor die assemblies and associated systems and methods | Hung-Cheng Chen, Yu-Chun Chen | 2024-01-02 |
HH
Hsuan Chao Hou
Overall (2024): #440,476 of 561,600Top 80%
1
Patents 2024