Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862607 | Composite dielectric structures for semiconductor die assemblies and associated systems and methods | Yu-Chun Chen, Hsuan Chao Hou | 2024-01-02 |
HC
Hung-Cheng Chen
Overall (2024): #439,921 of 561,600Top 80%
1
Patents 2024