Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040300 | Semiconductor package using hybrid-type adhesive | Min-Yu Lin, Kuo-Chang Chang, Jen-Chan Huang | 2024-07-16 |
| 12040377 | Semiconductor device, ferroelectric capacitor and laminated structure | Blanka Magyari-Kope | 2024-07-16 |