Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040300 | Semiconductor package using hybrid-type adhesive | Ying-Chih Chen, Min-Yu Lin, Jen-Chan Huang | 2024-07-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040300 | Semiconductor package using hybrid-type adhesive | Ying-Chih Chen, Min-Yu Lin, Jen-Chan Huang | 2024-07-16 |