Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094837 | Method of manufacturing semiconductor devices by filling grooves formed in a front side surface of a wafer with a side face protection material | Benjamin Bernard, Tobias Polster, Carsten von Koblinski | 2024-09-17 |