Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094837 | Method of manufacturing semiconductor devices by filling grooves formed in a front side surface of a wafer with a side face protection material | Christian Gruber, Benjamin Bernard, Tobias Polster | 2024-09-17 |
| 12087717 | Semiconductor package and methods of manufacturing a semiconductor package | Thomas Feil, Danny Clavette, Paul Ganitzer, Martin Poelzl | 2024-09-10 |