Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12129338 | Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same | Changbo SHIM, Seunghyun Song, Hwayeon Moon, Hee Yong Shim | 2024-10-29 |
| 12091510 | Thermosetting resin composite and metal clad laminate using the same | Changbo SHIM, Hee Yong Shim, Hwayeon Moon, Seunghyun Song | 2024-09-17 |
| 12037491 | Resin composition, prepreg including the same, laminated plate including the same, resin-coated metal foil including the same | Yongseon Hwang, Changbo SHIM, Hye Rim Park | 2024-07-16 |