Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12129338 | Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same | Changbo SHIM, Seunghyun Song, Hyunsung Min, Hee Yong Shim | 2024-10-29 |
| 12091510 | Thermosetting resin composite and metal clad laminate using the same | Changbo SHIM, Hyunsung Min, Hee Yong Shim, Seunghyun Song | 2024-09-17 |