Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12177983 | Electronic component housing package, electronic device, and electronic module | Keisuke Sawada | 2024-12-24 |
| 12009285 | Substrate having a recessed portion for an electronic component | Tomoyuki Iwata | 2024-06-11 |