Issued Patents 2024
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165918 | Conformal titanium nitride-based thin films and methods of forming same | Niloy Mukherjee, Hae Young Kim, Jerry Mack, Jae Seok Heo, Sung Hoon Jung +4 more | 2024-12-10 |
| 12147941 | Iterative monetization of precursor in process development of non-linear polar material and devices | Sasikanth Manipatruni, Niloy Mukherjee, Noriyuki Sato, Tanay Gosavi, James David Clarkson +3 more | 2024-11-19 |
| 12094923 | Rapid thermal annealing (RTA) methodologies for integration of perovskite-material based memory devices | Niloy Mukherjee, Jason Y. Wu, Pratyush Pandey, Zeying Ren, FNU Atiquzzaman +8 more | 2024-09-17 |
| 12062584 | Iterative method of multilayer stack development for device applications | Sasikanth Manipatruni, Niloy Mukherjee, Noriyuki Sato, Tanay Gosavi, Mauricio Manfrini +4 more | 2024-08-13 |
| 12034086 | Trench capacitors with continuous dielectric layer and methods of fabrication | Noriyuki Sato, Niloy Mukherjee, Rajeev Kumar Dokania, Amrita Mathuriya, Tanay Gosavi +3 more | 2024-07-09 |
| 12029043 | Planar and trench capacitors with hydrogen barrier dielectric for logic and memory applications and methods of fabrication | Noriyuki Sato, Niloy Mukherjee, Rajeev Kumar Dokania, Amrita Mathuriya, Tanay Gosavi +3 more | 2024-07-02 |
| 12022662 | Planar and trench capacitors for logic and memory applications and methods of fabrication | Noriyuki Sato, Niloy Mukherjee, Rajeev Kumar Dokania, Amrita Mathuriya, Tanay Gosavi +3 more | 2024-06-25 |
| 12016185 | Planar and trench capacitors for logic and memory applications | Noriyuki Sato, Niloy Mukherjee, Rajeev Kumar Dokania, Amrita Mathuriya, Tanay Gosavi +3 more | 2024-06-18 |
| 12010854 | Multi-level hydrogen barrier layers for memory applications and methods of fabrication | Noriyuki Sato, Niloy Mukherjee, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania +2 more | 2024-06-11 |
| 11996438 | Pocket flow for trench capacitors integrated with planar capacitors on a same substrate and method of fabrication | Noriyuki Sato, Niloy Mukherjee, Rajeev Kumar Dokania, Amrita Mathuriya, Tanay Gosavi +3 more | 2024-05-28 |
| 11985832 | Planar and trench capacitors with hydrogen barrier dielectric for logic and memory applications | Noriyuki Sato, Niloy Mukherjee, Rajeev Kumar Dokania, Amrita Mathuriya, Tanay Gosavi +3 more | 2024-05-14 |
| 11961877 | Dual hydrogen barrier layer for trench capacitors integrated with low density film for logic structures | Noriyuki Sato, Niloy Mukherjee, Rajeev Kumar Dokania, Amrita Mathuriya, Tanay Gosavi +3 more | 2024-04-16 |
| 11955512 | Dual hydrogen barrier layer for trench capacitors integrated with low density film for logic structures and methods of fabrication | Noriyuki Sato, Niloy Mukherjee, Rajeev Kumar Dokania, Amrita Mathuriya, Tanay Gosavi +3 more | 2024-04-09 |
| 11942365 | Multi-region diffusion barrier containing titanium, silicon and nitrogen | Vinayak Veer Vats, M. Ziaul Karim, Bo Seon Choi, Niloy Mukherjee | 2024-03-26 |
| 11908704 | Method of fabricating a perovskite-material based planar capacitor using rapid thermal annealing (RTA) methodologies | Niloy Mukherjee, Jason Y. Wu, Pratyush Pandey, Zeying Ren, FNU Atiquzzaman +8 more | 2024-02-20 |
| 11894417 | Method of fabricating a perovskite-material based trench capacitor using rapid thermal annealing (RTA) methodologies | Niloy Mukherjee, Jason Y. Wu, Pratyush Pandey, Zeying Ren, FNU Atiquzzaman +8 more | 2024-02-06 |
| 11869843 | Integrated trench and via electrode for memory device applications and methods of fabrication | Noriyuki Sato, Niloy Mukherjee, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania +2 more | 2024-01-09 |
| 11871584 | Multi-level hydrogen barrier layers for memory applications | Noriyuki Sato, Niloy Mukherjee, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania +2 more | 2024-01-09 |
| 11869928 | Dual hydrogen barrier layer for memory devices | Noriyuki Sato, Niloy Mukherjee, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania +2 more | 2024-01-09 |
| 11862517 | Integrated trench and via electrode for memory device applications | Noriyuki Sato, Niloy Mukherjee, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania +2 more | 2024-01-02 |