| 12165918 |
Conformal titanium nitride-based thin films and methods of forming same |
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| 12147941 |
Iterative monetization of precursor in process development of non-linear polar material and devices |
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| 12094923 |
Rapid thermal annealing (RTA) methodologies for integration of perovskite-material based memory devices |
Niloy Mukherjee, Jason Y. Wu, Pratyush Pandey, Zeying Ren, FNU Atiquzzaman +8 more |
2024-09-17 |
| 12062584 |
Iterative method of multilayer stack development for device applications |
Sasikanth Manipatruni, Niloy Mukherjee, Noriyuki Sato, Tanay Gosavi, Mauricio Manfrini +4 more |
2024-08-13 |
| 12034086 |
Trench capacitors with continuous dielectric layer and methods of fabrication |
Noriyuki Sato, Niloy Mukherjee, Rajeev Kumar Dokania, Amrita Mathuriya, Tanay Gosavi +3 more |
2024-07-09 |
| 12029043 |
Planar and trench capacitors with hydrogen barrier dielectric for logic and memory applications and methods of fabrication |
Noriyuki Sato, Niloy Mukherjee, Rajeev Kumar Dokania, Amrita Mathuriya, Tanay Gosavi +3 more |
2024-07-02 |
| 12022662 |
Planar and trench capacitors for logic and memory applications and methods of fabrication |
Noriyuki Sato, Niloy Mukherjee, Rajeev Kumar Dokania, Amrita Mathuriya, Tanay Gosavi +3 more |
2024-06-25 |
| 12016185 |
Planar and trench capacitors for logic and memory applications |
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2024-06-18 |
| 12010854 |
Multi-level hydrogen barrier layers for memory applications and methods of fabrication |
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2024-06-11 |
| 11996438 |
Pocket flow for trench capacitors integrated with planar capacitors on a same substrate and method of fabrication |
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2024-05-28 |
| 11985832 |
Planar and trench capacitors with hydrogen barrier dielectric for logic and memory applications |
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2024-05-14 |
| 11961877 |
Dual hydrogen barrier layer for trench capacitors integrated with low density film for logic structures |
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2024-04-16 |
| 11955512 |
Dual hydrogen barrier layer for trench capacitors integrated with low density film for logic structures and methods of fabrication |
Noriyuki Sato, Niloy Mukherjee, Rajeev Kumar Dokania, Amrita Mathuriya, Tanay Gosavi +3 more |
2024-04-09 |
| 11942365 |
Multi-region diffusion barrier containing titanium, silicon and nitrogen |
Vinayak Veer Vats, M. Ziaul Karim, Bo Seon Choi, Niloy Mukherjee |
2024-03-26 |
| 11908704 |
Method of fabricating a perovskite-material based planar capacitor using rapid thermal annealing (RTA) methodologies |
Niloy Mukherjee, Jason Y. Wu, Pratyush Pandey, Zeying Ren, FNU Atiquzzaman +8 more |
2024-02-20 |
| 11894417 |
Method of fabricating a perovskite-material based trench capacitor using rapid thermal annealing (RTA) methodologies |
Niloy Mukherjee, Jason Y. Wu, Pratyush Pandey, Zeying Ren, FNU Atiquzzaman +8 more |
2024-02-06 |
| 11869843 |
Integrated trench and via electrode for memory device applications and methods of fabrication |
Noriyuki Sato, Niloy Mukherjee, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania +2 more |
2024-01-09 |
| 11871584 |
Multi-level hydrogen barrier layers for memory applications |
Noriyuki Sato, Niloy Mukherjee, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania +2 more |
2024-01-09 |
| 11869928 |
Dual hydrogen barrier layer for memory devices |
Noriyuki Sato, Niloy Mukherjee, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania +2 more |
2024-01-09 |
| 11862517 |
Integrated trench and via electrode for memory device applications |
Noriyuki Sato, Niloy Mukherjee, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania +2 more |
2024-01-02 |