Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087663 | Optimization of the thermal performance of the 3D ICs utilizing the integrated chip-size double-layer or multi-layer microchannels | Kambiz Vafai | 2024-09-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087663 | Optimization of the thermal performance of the 3D ICs utilizing the integrated chip-size double-layer or multi-layer microchannels | Kambiz Vafai | 2024-09-10 |