Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087663 | Optimization of the thermal performance of the 3D ICs utilizing the integrated chip-size double-layer or multi-layer microchannels | Sainan Lu | 2024-09-10 |
| 11942453 | Thermal management of three-dimensional integrated circuits | Andisheh Tavakoli, Mohammad Reza Salimpour | 2024-03-26 |