Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12116513 | Adhesion/peeling method, and adhesion/peeling device | Takashi Usui, Tetsuya Kugimiya, Kazuo Watabe, Keisuke Ueno, Hidefumi Takamine +2 more | 2024-10-15 |
| 12090566 | Electrically assisted pressure joining apparatus and electrically assisted pressure joining method | Sung-Tae Hong, Doo-Man Chun, Hong-seok PARK, Heung Nam Han, Ju Won Park +1 more | 2024-09-17 |
| 11981616 | Method for preparing 3,3′-diaminobenzidine | Yun Ling, Kun Wang, Lizhu Chen, Wei Yin, Jinying Zhang | 2024-05-14 |
| 11879793 | Vibration sensor and sensor module | — | 2024-01-23 |