Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033955 | Electromagnetic shielding package structure comprising electroplating layer and package method thereof | Yi-Jung Liu, Zhen Gong | 2024-07-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033955 | Electromagnetic shielding package structure comprising electroplating layer and package method thereof | Yi-Jung Liu, Zhen Gong | 2024-07-09 |