Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033955 | Electromagnetic shielding package structure comprising electroplating layer and package method thereof | MAN BAO, Zhen Gong | 2024-07-09 |
| 11951571 | Method of forming package structure | Cheng-Fu YU, Kai-Jih SHIH | 2024-04-09 |