Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170240 | Lead frame for improving adhesive fillets on semiconductor die corners | Rennier Rodriguez, Jefferson Talledo | 2024-12-17 |
| 12159820 | Flat no-lead package with surface mounted structure | Rennier Rodriguez, Aiza Marie Agudon | 2024-12-03 |
| 12074100 | Flat no-lead package with surface mounted structure | Rennier Rodriguez, Aiza Marie Agudon | 2024-08-27 |