Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170240 | Lead frame for improving adhesive fillets on semiconductor die corners | Rennier Rodriguez, Maiden Grace Maming | 2024-12-17 |
| 12094725 | Leadframe package with pre-applied filler material | Frederick Ray Gomez | 2024-09-17 |
| 12080657 | Die embedded in substrate with stress buffer | — | 2024-09-03 |
| 11948868 | Compact leadframe package | — | 2024-04-02 |
| 11897763 | Capless semiconductor package with a micro-electromechanical system (MEMS) | — | 2024-02-13 |