Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068233 | Adapter board and method for forming same, packaging method, and package structure | Cai Qiaoming, Yang Lie Yong, Chen Wei | 2024-08-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068233 | Adapter board and method for forming same, packaging method, and package structure | Cai Qiaoming, Yang Lie Yong, Chen Wei | 2024-08-20 |